Optimize the cooling performance of your high-density multi-node servers with the genuine Supermicro SNK-P0067PSM 1U Passive CPU Heatsink. Engineered specifically for Supermicro’s multi-node TwinPro and BigTwin architectures, this server-grade cooler features a specialized middle-air-channel configuration.
The middle-channel design is precision-crafted to align seamlessly with multi-node node layouts, serving as an ideal "Front CPU" cooler. It ensures that heavy, directional airflow from the central chassis fan walls passes directly through the cooling fins, making it a critical component for node maintenance, upgrades, or replacements.
Technical Specifications:
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Form Factor: 1U Proprietary / Multi-Node Height
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Cooling Type: Passive (relies entirely on high-pressure chassis airflow)
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Dimensions: 108mm (Length) x 78mm (Width) x 25.5mm (Height)
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Thermal Capacity (TDP Limit): Supports processors up to 165 Watts TDP maximum
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Socket Compatibility: Intel Socket FCLGA3647-0 (Narrow ILM Only)
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Platform Compatibility: Supermicro X11 Purley Platform
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Manufacturer Part Number (MPN): SNK-P0067PSM
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Special Design: Integrated middle-air-channel optimized for multi-node chassis airflow
System & Platform Validation:
This heatsink is fully certified by the manufacturer for deployment across Uni-Processor (UP), Dual-Processor (DP), and Multi-Processor (MP) configurations inside high-density X11 environments:
- Supermicro TwinPro 2U 4-Node Series systems
- Supermicro BigTwin High-Density Series systems
Processor Generation Support:
Exclusively handles the earliest iterations of the Intel Xeon Scalable processor family:
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1st Generation Intel Xeon Scalable Processors (Skylake-SP: 31xx, 41xx, 51xx, 61xx, 81xx Series)
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2nd Generation Intel Xeon Scalable Processors (Cascade Lake: 32xx, 42xx, 52xx, 62xx, 82xx Series)
Quick Reference: Supermicro X11 1U Heatsink Matrix
To ensure accurate deployment, note how the SNK-P0067PSM compares to sister models in the X11 Purley 1U lineup:
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SNK-P0067PS: Standard 1U passive design without a middle-air-channel. Supports up to 205W TDP. Best for traditional, standalone 1U rackmount chassis.
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SNK-P0067PSM (This Model): Features a proprietary middle-air-channel. Supports up to 165W TDP. Explicitly validated for TwinPro and BigTwin multi-node systems.
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SNK-P0067PSMB: Features a proprietary middle-air-channel. Supports up to 165W TDP. Explicitly validated for WIO and SuperBlade architectures.
⚠️ Critical Compatibility Constraints:
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Mounting Footprint: This is a Narrow ILM rectangular footprint component (56mm x 107.5mm). It will not fit motherboards built for Square ILM configurations.
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TDP Restriction: Please confirm your Xeon processor's TDP rating before purchasing. This heatsink has a strict 165W limit and cannot support higher wattage (e.g., 205W) processors.
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Not for Legacy Systems: This unit is physically incompatible with older Intel Xeon E5-2600 v3/v4 CPUs or X10-generation system architecture (Socket LGA2011-3).
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Not for Newer Hardware: This heatsink does not cross over to newer generations. It cannot be used with 3rd Gen Intel Xeon Scalable (LGA4189) or 4th/5th Gen Intel Xeon Scalable (LGA4677) processors.
