Intel Xeon E5-4669v3 2.10GHz 18 Core 45MB 135W FCLGA2011-3 CPU CM8064401864100 SR22M

Complete Enterprise‑Grade Description Using All Specifications & Manufacturer Data

The Intel Xeon E5‑4669 v3 (Manufacturer Part Number CM8064401864100, S‑Spec SR22M) is a top‑tier, multi‑processor server CPU built on Intel’s Haswell‑EP 22nm architecture. Designed for the Xeon E5‑4600 v3 Product Family, this processor delivers extreme scalability, supporting up to four CPUs (4S) on a single motherboard for high‑density enterprise computing.

With 18 physical cores, 36 threads, 45MB Smart Cache, and a robust 135W TDP, the E5‑4669 v3 is engineered for mission‑critical workloads such as virtualization clusters, cloud infrastructure, scientific computing, and large enterprise databases.

Manufacturer & Model Identification

• Manufacturer: Intel Corporation

• Product Family: Intel Xeon Processor E5‑4600 v3

• Model: Xeon E5‑4669 v3

• Intel Ordering Code: CM8064401864100

• Intel S‑Spec: SR22M

Core Architecture & Performance

• Lithography: 22nm Haswell‑EP

• Transistor Count: 5,690 million

• Socket Type: FCLGA2011‑3 (Socket R3)

• Base Frequency: 2.10 GHz

• Max Turbo Frequency: 2.90 GHz

• Core Count: 18 Cores

• Thread Count: 36 Threads (Hyper‑Threading Enabled)

• Smart Cache: 45 MB

• TDP: 135W

• Bus Speed: 9.6 GT/s QPI

• Number of QPI Links: 2

Memory Support

• Memory Types: DDR4 ECC Registered (RDIMM) / LRDIMM

• Supported Speeds: 1600 / 1866 / 2133 MHz

• Memory Channels: 4 (Quad‑Channel)

• Max Bandwidth: Up to 68.2 GB/s

• ECC Support: Yes (Required for server stability)

• Note: Non‑ECC desktop DDR4 memory is not supported.

Expansion & Advanced Technologies

• PCI Express Version: PCIe 3.0

• PCIe Lanes: 40

• Intel Turbo Boost Technology: 2.0

• Intel vPro® Platform: Supported

• Virtualization: VT‑x, VT‑d, EPT

• Instruction Sets: AVX 2.0, AES‑NI

Scalability & Enterprise Deployment

This CPU belongs to Intel’s E5‑4600 multi‑socket series, enabling 1S to 4S configurations. In a full 4‑CPU setup, your system can reach:

• 72 physical cores

• 144 threads

• Massive parallel throughput for enterprise‑level workloads.

Compatible Server Platforms (Manufacturer‑Verified)

Dell

• Dell PowerEdge FC830 (FX2 chassis blade node)

• Dell PowerEdge M830 (blade server)

• Dell PowerEdge R830 (4‑socket 2U rack server)

HPE

• HPE ProLiant DL560 Gen9 (Part: 742708‑B21)

• HPE BL660c Gen9 (Part: 728380‑B21)

Custom Enterprise Boards

• Motherboards using Intel C612 / C610 chipsets

• Must explicitly support Xeon E5‑4600 v3 microcode

Note: Consumer X99 boards generally do not support E5‑4600 CPUs unless BIOS microcode is confirmed.

Thermal & Power Requirements

• Cooling: Requires server‑grade heatsinks for Socket R3

• Airflow: Optimized for rack environments with high‑flow cooling

• Power Delivery: Must support continuous 135W per CPU socket

Standard desktop coolers for LGA2011 may not fit due to retention clip and Z‑height differences.

Ideal Use Cases

• Virtualization (VMware, Hyper‑V, Proxmox)

• Enterprise databases (SQL, Oracle, SAP)

• Cloud infrastructure & private cloud nodes

• Scientific modeling and simulation

• High‑density blade server expansion

• Multi‑socket rack server upgrades